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Hewlett Packard - HSMC-H670

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Hewlett Packard

HSMC-H670

Surface mount flip chip LED with industry standard footprint, high luminous efficiency, and improved reliability through elimination of internal wire bond.

Specifications

Technical

DC Forward Current
20 mA
Power Dissipation
50 mW
Reverse Voltage
5 V
Operating Temperature Range
-40 to +85 °C
Storage Temperature Range
-40 to +85 °C
Reliability Feature
Elimination of internal wire bond
Compatibility
IR solder process
Optics
Diffused

Dimensions

Footprint
2.0 x 1.25 mm
Profile Height
1.1 mm

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Availability

All stock is new and certified authentic, shipping directly from a verified manufacturer.

Ships from

United States

United States

Ships in

3-5 Days

Stock

1

unit

United States

Warehouse

PX3TAK

Certifications

ISO 9001:2015

Price

$3.57

/unit

3-5 Days

MOQ:

1 unit

Minimum Order Quantity

The minimum amount required to make a purchase.

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